LM3281

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SNVSA38 – NOVEMBER 2014

6.4 Thermal Information

DSBGA

YFQ

UNIT

6 PINS

(2)

Junction-to-ambient thermal resistance

131.2

Junction-to-case (top) thermal resistance

1.7

Junction-to-board thermal resistance

25.6

°C/W

Junction-to-top characterization parameter

4.7

Junction-to-board characterization parameter

25.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

is used.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

3

5.5

V

Output voltage measured at FB pin

3.2

3.3

3.4

Total supply current in shutdown

EN = SW = FB = MODE = 0 V,

0.1

1

Steady State

µA

Quiescent current

No switching

15

25

Internal oscillator frequency

5.4

6

6.6

MHz

EN, MODE pins high level input

1.2

voltage

V

EN, MODE pins low level input voltage

0.4

EN, MODE high level input current

1

µA

EN, MODE low level input current

EN = MODE = 0 V

–1

(1)

All voltages are with respect to the GND pin.

(2)

otherwise noted.

(3)

Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis over the ambient temperature operating

range –30°C to 90°C. Limits are not specified by production testing.

(4)

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