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MAX606ESA Datasheet(PDF) 11 Page - Maxim Integrated Products |
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MAX606ESA Datasheet(HTML) 11 Page - Maxim Integrated Products |
11 / 12 page Low-Profile, 5V/12V or Adjustable, Step-Up DC-DC Converters for Flash Memory/PCMCIA Cards ______________________________________________________________________________________ 11 Diode Selection The MAX606/MAX607’s high switching frequency demands a high-speed rectifier. Use a Schottky diode with at least a 0.5A average current rating and a 1.2A peak current rating, such as an MBR0520L. See Table 3 for a list of component suppliers. Capacitor Selection Output Filter Capacitor The output voltage ripple is a function of the output capacitor’s equivalent series resistance (ESR) and capacitance. For best performance, use ceramic capacitors. Higher-ESR capacitors, such as tantalums, will cause excessive ripple. See Table 3 for a list of component suppliers. The output voltage ripple is approximately 100mVp-p for the 12V Standard Application Circuit (Figure 1) and 50mV for the 5V circuit (Figure 2). To further reduce this ripple, or to reduce the ripple on a different application circuit, increase the value of the output filter capacitor. If this capacitor is low ESR (e.g., ceramic), the output voltage ripple will be dominated by this capacitance. Input Bypass Capacitors For applications where the MAX606/MAX607 are physi- cally close to the input supply’s filter capacitor (e.g., in PCMCIA drivers from the host computer), the input bypass capacitor may not be necessary. In other applications where the MAX606/MAX607 are more than a few inches away from the supply (such as memory cards), the input bypass capacitor is needed to reduce reflected current ripple to the supply and improve efficiency by creating a low-impedance path for the ripple current. Under these circumstances, the associated high Q and low ESR of ceramic capacitors do not diminish the problem. Therefore, include some low-Q, moderate-ESR capacitance (e.g., tantalum) at the input in order to reduce ringing. Layout The MAX606/MAX607’s high-frequency operation and high peak currents make PC board layout critical to minimize ground bounce and noise. Locate input bypass and output filter capacitors as close to the device pins as possible. All connections to OUT (and to FB when operating in adjustable-output mode) should also be kept as short as possible. A ground plane is recommended. Solder GND and PGND directly to the ground plane. Refer to the MAX606/MAX607 evaluation kit manual for a suggested surface-mount layout. ___________________Chip Topography LX 0.084" (2.134mm) 0.058" (1.473mm) LX LX OUT SS GND PGND PGND PGND SEL SHDN V+ TRANSISTOR COUNT: 613 SUBSTRATE CONNECTED TO GND |
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