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OPA180 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA180 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 38 page OPA180, OPA2180, OPA4180 www.ti.com SBOS584D – NOVEMBER 2011 – REVISED MAY 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Single supply 4.5 36 V Supply voltage [(V+) – (V–)] Bipolar supply ±2.25 ±18 V Operating temperature –40 105 °C 7.4 Thermal Information: OPA180 OPA180 THERMAL METRIC(1) D (SO) DBV (SOT23) DGK (MSOP) UNIT 8 PINS 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 115.8 158.8 180.4 RθJC(top) Junction-to-case(top) thermal resistance 60.1 60.7 67.9 RθJB Junction-to-board thermal resistance 56.4 44.8 102.1 °C/W ψJT Junction-to-top characterization parameter 12.8 1.6 10.4 ψJB Junction-to-board characterization parameter 55.9 4.2 100.3 RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Thermal Information: OPA2180 OPA2180 THERMAL METRIC(1) D (SO) DGK (MSOP) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 111.0 159.3 RθJC(top) Junction-to-case (top) thermal resistance 54.9 37.4 RθJB Junction-to-board thermal resistance 51.7 48.5 °C/W ψJT Junction-to-top characterization parameter 9.3 1.2 ψJB Junction-to-board characterization parameter 51.1 77.1 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.6 Thermal Information: OPA4180 OPA4180 THERMAL METRIC(1) D (SO) PW (TSSOP) UNIT 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 RθJC(top) Junction-to-case (top) thermal resistance 51.8 24.4 RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 ψJB Junction-to-board characterization parameter 42.2 54.3 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA180 OPA2180 OPA4180 |
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