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MAX4365EUA Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX4365EUA Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 15 page The increase in power delivered by the BTL configura- tion directly results in an increase in internal power dis- sipation over the single-ended configuration. The maximum power dissipation for a given VCC and load is given by the following equation: If the power dissipation for a given application exceeds the maximum allowed for a given package, reduce VCC, increase load impedance, decrease the ambient temperature or add heat sinking to the device. Large output, supply, and ground PC board traces improve the maximum power dissipation in the package. Thermal-overload protection limits total power dissipa- tion in the MAX4364/MAX4365. When the junction tem- perature exceeds +160°C, the thermal protection circuitry disables the amplifier output stage. The ampli- fiers are enabled once the junction temperature cools by 15°C. This results in a pulsing output under continu- ous thermal overload conditions as the device heats and cools. The MAX4365 QFN package features an exposed ther- mal pad on its underside. This pad lowers the thermal resistance of the package by providing a direct heat conduction path from the die to the PC board. Connect the exposed thermal pad to circuit ground by using a large pad, ground plane, or multiple vias to the ground plane. Efficiency The efficiency of the MAX4364/MAX4365 is calculated by taking the ratio of the power delivered to the load to the power consumed from the power supply. Output power is calculated by the following equations: where VPEAK is half the peak-to-peak output voltage. In BTL amplifiers, the supply current waveform is a full- wave rectified sinusoid with the magnitude proportional to the peak output voltage and load. Calculate the sup- ply current and power drawn from the power supply by the following: The efficiency of the MAX4364/MAX4365 is: The device efficiency values in Table 1 are calculated based on the previous equation and do include the effects of quiescent current. Note that efficiency is low at low output-power levels, but remains relatively con- stant at normal operating, output-power levels. Component Selection Gain-Setting Resistors External feedback components set the gain of both devices. Resistors RF and RIN (see Typical Application Circuit/Functional Diagram) set the gain of the amplifier as follows: Optimum output offset is achieved when RF = 20k Ω. Vary the gain by changing the value of RIN. When using the MAX4364/MAX4365 in a high-gain configuration (greater than 8V/V), a feedback capacitor may be required to maintain stability (see Figure 2). CF and RF limit the bandwidth of the device, preventing high-fre- quency oscillations. Ensure that the pole created by CF and RF is not within the frequency band of interest. Input Filter The input capacitor (CIN), in conjunction with RIN forms a highpass filter that removes the DC bias from an incoming signal. The AC-coupling capacitor allows the amplifier to bias the signal to an optimum DC level. Assuming zero source impedance, the -3dB point of the highpass filter is given by: Choose RIN according to the Gain-Setting Resistors section. Choose CIN such that f-3dB is well below the lowest frequency of interest. Setting f-3dB too high affects the low-frequency response of the amplifier. Use capacitors whose dielectrics have low-voltage coeffi- ƒ= −3 1 2 dB IN IN RC π A R R VD F IN =× 2 η π == P P PR V OUT IN OUT L CC 2 2 PV V R IN CC PEAK L = 2 π I V R CC PEAK L = 2 π P V R OUT PEAK L = 2 2 P V R DISS MAX CC L () = 2 2 2 π 1.4W and 1W, Ultra-Small, Audio Power Amplifiers with Shutdown 10 ______________________________________________________________________________________ |
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