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AFCT-5961ATLZ Datasheet(PDF) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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AFCT-5961ATLZ Datasheet(HTML) 4 Page - AVAGO TECHNOLOGIES LIMITED |
4 / 16 page 4 Figure3.BlockDiagram Package The overall package concept for these devices consists of the following basic elements; two optical subassem- blies, a electrical subassembly and the housing as illus- trated in the block diagram in Figure 3. The package outline drawing and pin out are shown in Figures 4 and 5. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Avago Technologies transceiver design complies with the maximum height allowed for the LC connector over the entire length of the package. The electrical subassembly consists of high volume multilayer printed circuit board on which the IC and various surface-mounted passive circuit elements are attached. The optical subassemblies are attached to the electrical subassembly. These two units are then fitted within the outer housing of the transceiver. The housing is then encased with a metal EMI protective shield. The electrical subassemby carries the signal pins that exit from the bottom of the transceiver. The solder posts are designed to provide the mechanical strength required to withstand the loads imposed on the trans- ceiver by mating with the LC connectored fiber cables. Although they are not connected electrically to the transceiver, it is recommended to connect them to chassis ground. DATA OUT SIGNAL DETECT DATA IN DATA IN Tx DISABLE QUANTIZER IC LASER DRIVER AND CONTROL CIRCUIT PIN PHOTODIODE PREAMPLIFIER SUBASSEMBLY LASER OPTICAL SUBASSEMBLY DATA OUT LC RECEPTACLE R X SUPPLY T X SUPPLY R X GROUND T X GROUND LASER BIAS MONITORING LASER DIODE MODULATOR CASE NOTE NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION. |
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