4

Figure3.BlockDiagram

Package

The overall package concept for these devices consists

of the following basic elements; two optical subassem-

blies, a electrical subassembly and the housing as illus-

trated in the block diagram in Figure 3.

The package outline drawing and pin out are shown in

Figures 4 and 5. The details of this package outline and

pin out are compliant with the multisource definition of

the 2 x 5 DIP. The low profile of the Avago Technologies

transceiver design complies with the maximum height

allowed for the LC connector over the entire length of

the package.

The electrical subassembly consists of high volume

multilayer printed circuit board on which the IC and

various surface-mounted passive circuit elements are

attached.

The optical subassemblies are attached to the electrical

subassembly. These two units are then fitted within the

outer housing of the transceiver. The housing is then

encased with a metal EMI protective shield.

The electrical subassemby carries the signal pins that

exit from the bottom of the transceiver. The solder

posts are designed to provide the mechanical strength

required to withstand the loads imposed on the trans-

ceiver by mating with the LC connectored fiber cables.

Although they are not connected electrically to the

transceiver, it is recommended to connect them to

chassis ground.

DATA OUT

SIGNAL

DETECT

DATA IN

DATA IN

Tx DISABLE

QUANTIZER IC

LASER DRIVER

AND CONTROL

CIRCUIT

PIN PHOTODIODE

PREAMPLIFIER

SUBASSEMBLY

LASER

OPTICAL

SUBASSEMBLY

DATA OUT

LC

RECEPTACLE

R

T

R

T

LASER BIAS

MONITORING

LASER DIODE

MODULATOR

CASE

NOTE

NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.