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74AVCH16244 Datasheet(PDF) 11 Page - NXP Semiconductors |
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74AVCH16244 Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 16 page 2000 Mar 07 11 Philips Semiconductors Product Specification 16-bit buffer/line driver; 3.6 V tolerant; 3-state 74AVCH16244 PACKAGE OUTLINE UNIT A1 A2 A3 bp cD(1) E(2) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 DIMENSIONS (mm are the original dimensions). Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. SOT362-1 95-02-10 99-12-27 w M θ A A1 A2 D L p Q detail X E Z e c L X (A ) 3 0.25 124 48 25 y pin 1 index b H 1.05 0.85 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 1 0.25 8.3 7.9 0.50 0.35 0.8 0.4 0.08 0.8 0.4 p E v M A A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 A max. 1.2 0 2.5 5 mm scale MO-153 |
Similar Part No. - 74AVCH16244_15 |
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Similar Description - 74AVCH16244_15 |
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