IR2304(S)&(PbF)

2

www.irf.com

Symbol

Definition

Min.

Max.

Units

High side offset voltage

High side floating supply voltage

-0.3

625

High side floating output voltage HO

Low side and logic fixed supply voltage

-0.3

25

Low side output voltage LO

-0.3

Logic input voltage (HIN, LIN)

-0.3

Com

Logic ground

Allowable offset voltage SLEW RATE

—

50

V/ns

8-Lead SOIC

—

0.625

8-Lead PDIP

—

1.0

Thermal resistance, junction to ambient

8-Lead SOIC

—

200

8-Lead PDIP

—

125

Junction temperature

—

150

Storage temperature

-50

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance

and power dissipation ratings are measured under board mounted and still air conditions.

V

°C

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

High side floating supply offset voltage

Note 1

600

High side (HO) output voltage

Low side (LO) output voltage

COM

Logic input voltage (HIN, LIN)

COM

Low side supply voltage

10

20

Ambient temperature

-40

125

°C

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the

V

W

°C/W