TB62747AFG/AFNG/AFNAG/BFNAG

2009-01-21

6

Characteristics

Symbol

Rating *1

Unit

Power supply voltage

−0.4 to 6.0

V

Output current

55

mA

Logic input voltage

V

Output voltage

−0.3 to 26

V

Operating temperature

−40 to 85

°C

Storage temperature

−55 to 150

°C

Thermal resistance

Rth(j-a)

94 (AFG) *3, 120 (AFNG) *3, 80.07(AFNAG/BFNAG)

When mounted PCB

°C/W

Power dissipation

1.32 (AFG) *3, 1.04 (AFNG) *3, 1.56(AFNAG/BFNAG)

When mounted PCB

W

Note1: Voltage is ground referenced.

Note2: However, do not exceed 6V.

Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming)

Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each

degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).

Operating Conditions

Characteristics

Symbol

Test Conditions

Min

Typ.

Max

Unit

Power supply voltage

⎯

3.0

⎯

5.5

V

Output voltage when OFF

OUTn

0.4

⎯

4.0

V

High level logic input voltage

SIN,SCK, SLAT , OE

0.7

×

⎯

V

Low level logic input voltage

SIN,SCK, SLAT , OE

GND

⎯

0.3

×

V

High level SOUT output current

⎯

⎯

⎯

−1

mA

Low level SOUT output current

⎯

⎯

⎯

1

mA

1.5

⎯

35

Constant current output

1.5

⎯

45

mA

Characteristics

Symbol

Test

Circuits

Test Conditions

Min

Typ.

Max

Unit

Serial data transfer frequency

6

⎯

⎯

⎯

25

MHz

6

⎯

5

⎯

⎯

ns

Hold time

6

⎯

5

⎯

⎯

ns

6

⎯

5

⎯

⎯

ns

Setup time

6

⎯

5

⎯

⎯

ns

Maximum clock rise time

6

*1

⎯

⎯

500

ns

Maximum clock fall time

6

*1

⎯

⎯

500

ns

Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock

waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind

when designing your application.