NXP Semiconductors

BYV32G-200

Dual ultrafast power diode

© NXP B.V. 2011.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 11 January 2011

Document identifier: BYV32G-200

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1

General description . . . . . . . . . . . . . . . . . . . . . .1

1.2

Features and benefits . . . . . . . . . . . . . . . . . . . . .1

1.3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4

Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2

Pinning information . . . . . . . . . . . . . . . . . . . . . . .2

3

Ordering information . . . . . . . . . . . . . . . . . . . . . .2

4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5

Thermal characteristics . . . . . . . . . . . . . . . . . . .4

6

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5

7

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7

8

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8

9

Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9

9.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9

9.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

9.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

9.4

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10

10

Contact information. . . . . . . . . . . . . . . . . . . . . .10