10

Note:

1. Top view

Figure 25. PCB Layout, Via Detail

Figure 26. ACMD-7606 Superposed on PCB Layout

Notes:

1. Dimensions in mm

2. Top view

3. Via arrays: horiz pitch = 0.25, vert pitch = 0.25

141 X Ø 0.10 VIA

VIA ARRAY 1

2 X 0.17

VIA ARRAY 3

2X 0.12

VIA ARRAY 2

2.30

8 X 0.40 X 0.40

0.30 X 0.80

CHAMFER 0.12 X 45°

Figure 27. Recommended Solder Stencil

Figure 28. Solder Stencil Superposed on ACMD-7606

Notes:

1. Dimensions in mm

2. Top view

3. Chamfer or radius all corners 0.05 mm min

Notes:

1. Top view

2. Peripheral clearance of stencil aperture for center device pad is

0.05 mm. All other apertures match device pad 1:1