BAT54_SER

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 5 — 5 October 2012

3 of 11

NXP Semiconductors

BAT54 series

Schottky barrier diodes

5.

Limiting values

[1]

[2]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6.

Thermal characteristics

[1]

For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Per diode

reverse voltage

-

30

V

forward current

200

mA

repetitive peak forward

current

-300

mA

non-repetitive peak

forward current

square wave;

[1] -600

mA

Per device; one diode loaded

total power dissipation

[2] -250

mW

junction temperature

-

150

C

ambient temperature

55

+150

C

storage temperature

65

+150

C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device; one diode loaded

thermal resistance from

junction to ambient

in free air

[1][2] -

-

500

K/W