NCV8537

http://onsemi.com

4

PIN FUNCTION DESCRIPTION

Pin No.

Pin Name

Description

1, 2

3

SENSE/ADJ

For output voltage sensing, connect to Pins 1 and 2.at Fixed output Voltage version

Adjustable pin at Adjustable output version

4

GND

Power Supply Ground

5

PWRG

Power Good

6

NC

Not Connected

7

NR

Noise Reduction Pin. This is an optional pin used to further reduce noise.

8

SD

Shutdown pin. When not in use, this pin should be connected to the input pin.

9, 10

Power Supply Input Voltage

EPAD

EPAD

Exposed thermal pad should be connected to ground.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

−0.3 to +16

V

Output Voltage

V

PWRG Pin Voltage

−0.3 to +16

V

Shutdown Pin Voltage

−0.3 to +16

V

Junction Temperature Range

−40 to +150

C

Storage Temperature Range

−50 to +150

C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device series contains ESD protection and exceeds the following tests:

Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114)

Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115)

Charged Device Model (CDM) tested per EIA/JESD22−C101.

THERMAL CHARACTERISTICS

Characteristic

Test Conditions (Typical Value)

Unit

Min Pad Board (Note 1)

1, Pad Board (Note 1)

Junction−to−Air, qJA

215

66

C/W

Junction−to−Pin, J−L4

58

18

C/W

1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and

heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions

are under natural convection or zero air flow.