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NCP705 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP705 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 20 page NCP705 www.onsemi.com 3 Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name − Fixed Pin Name − Adjustable Description 1 OUT OUT Regulated output voltage pin. A small 1 mF ceramic capacitor is needed from this pin to ground to assure stability. 2 N/C ADJ Feedback pin for set−up output voltage. Use resistor divider for voltage selection. 3 GND GND Power supply ground. Expose pad must be tied with GND pin. Soldered to the copper plane allows for effective heat dissipation. 4 EN EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 5 N/C N/C Not connected. This pin can be tied to ground to improve thermal dissipation. 6 IN IN Input pin. A small capacitor is needed from this pin to ground to assure stability. Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Adjustable Input VADJ −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s Maximum Junction Temperature TJ(MAX) 150 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. Table 3. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, WDFN6 2x2 mm Thermal Resistance, Junction−to−Air Thermal Resistance Parameter, Junction−to−Board qJA YJB 116.5 30 °C/W 3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area. |
Similar Part No. - NCP705_14 |
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