NCP571, NCV571

http://onsemi.com

2

TSOP−5 package

1

3

NC

2

GND

Enable

4

5

(Top View)

DFN6 package

1

3

Enable

2

NC

GND

4

6

(Top View)

EP

5 NC

PIN CONNECTIONS

PIN FUNCTION DESCRIPTION

DFN6

TSOP−5

Pin Name

Description

1

5

Regulated output voltage.

2

4

NC

No Internal Connection. It is recommended to connect this pin to GND potential.

3

2

GND

Power supply ground.

4

3

Enable

This input is used to place the device into low−power standby. When this input is

pulled low, the device is disabled. If this function is not used, Enable pin should be

5

−

NC

No Internal Connection. It is recommended to connect this pin to GND potential.

6

1

Positive power supply input voltage.

EP

−

EP

No Internal Connection. It is recommended to connect this pin to GND potential.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

0 to 12

V

Enable Voltage

V

Output Voltage

V

Power Dissipation

Internally Limited

W

Operating Junction Temperature

+150

°C

Operating Ambient Temperature

NCP571

NCV571

−40 to +85

−40 to +125

°C

Storage Temperature

−55 to +150

°C

ESD Capability, Human Body Model (Note 1)

2000

V

ESD Capability, Machine Mode (Note 1)

200

V

ESD Capability, Charged Device Model (Note 1)

1000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard)

2. Latchup capability (85

°C) $100 mA DC with trigger voltage.

THERMAL CHARACTERISTICS

Rating

Symbol

Test Conditions

Typical Value

Unit

Junction−to−Ambient

TSOP−5

250

°C/W

PSIJ−Lead 2

TSOP−5

68

°C/W

Junction−to−Ambient

DFN6

190

°C/W

PSIJ−Lead 2

DFN6

84

°C/W

NOTE:

Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following

boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.