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NCV4266-2CST33T3G Datasheet(PDF) 9 Page - ON Semiconductor

Part # NCV4266-2CST33T3G
Description  150 mA Low Iq, Low-Dropout Voltage Regulator with Enable
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV4266-2CST33T3G Datasheet(HTML) 9 Page - ON Semiconductor

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NCV4266−2C
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9
Calculating Power Dissipation
in a Single Output Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 20) is:
PD(max) + [VI(max) * VQ(min)]IQ(max)
) VI(max)Iq
(eq. 1)
where
VI(max)
is the maximum input voltage,
VQ(min)
is the minimum output voltage,
IQ(max)
is the maximum output current for the
application,
Iq
is the quiescent current the regulator
consumes at IQ(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
R
qJA +
150oC
* TA
PD
(eq. 2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA less than the calculated value in Equation 2 will keep
the die temperature below 150
°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
SMART
REGULATOR
®
Iq
Control
Features
IQ
II
Figure 20. Single Output Regulator with Key
Performance Parameters Labeled
VI
VQ
}
Heatsinks
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and
the outside environment will have a thermal resistance.
Like series electrical resistances, these resistances are
summed to determine the value of RqJA:
R
qJA + RqJC ) RqCS ) RqSA
(eq. 3)
where
RqJC is the junction−to−case thermal resistance,
RqCS is the case−to−heatsink thermal resistance,
RqSA is the heatsink−to−ambient thermal
resistance.
RqJC appears in the package section of the data sheet.
Like RqJA, it too is a function of package type. RqCS and
RqSA are functions of the package type, heatsink and the
interface between them. These values appear in data sheets
of heatsink manufacturers.
Thermal, mounting, and heatsinking considerations are
discussed in the ON Semiconductor application note
AN1040/D.


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