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SMUN2230T1G Datasheet(PDF) 4 Page - ON Semiconductor |
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SMUN2230T1G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 12 page MUN2230, MMUN2230L, MUN5230, DTC113EE, DTC113EM3, NSBC113EF3 www.onsemi.com 4 Table 2. THERMAL CHARACTERISTICS Characteristic Unit Max Symbol THERMAL CHARACTERISTICS (SOT−723) (DTC113EM3) Thermal Resistance, (Note 1) Junction to Ambient (Note 2) RqJA 480 205 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C THERMAL CHARACTERISTICS (SOT−1123) (NSBC113EF3) Total Device Dissipation TA = 25°C (Note 3) (Note 4) Derate above 25 °C (Note 3) (Note 4) PD 254 297 2.0 2.4 mW mW/ °C Thermal Resistance, (Note 3) Junction to Ambient (Note 4) RqJA 493 421 °C/W Thermal Resistance, Junction to Lead (Note 3) RqJL 193 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. FR−4 @ Minimum Pad. 2. FR−4 @ 1.0 x 1.0 Inch Pad. 3. FR−4 @ 100 mm2, 1 oz. copper traces, still air. 4. FR−4 @ 500 mm2, 1 oz. copper traces, still air. |
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