PBSS4041PT_2

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 02 — 9 March 2010

11 of 15

NXP Semiconductors

PBSS4041PT

11. Soldering

Fig 16. Reflow soldering footprint SOT23 (TO-236AB)

Fig 17. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3

×)

0.6

(3

×)

0.6

(3

×)

0.7

(3

×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2

×)

1.2

(2

×)

2.2

2.6

Dimensions in mm