PBSS4032PX_1

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Product data sheet

Rev. 01 — 1 April 2010

11 of 15

NXP Semiconductors

PBSS4032PX

11. Soldering

Fig 16. Reflow soldering footprint SOT89 (SC-62)

Fig 17. Wave soldering footprint SOT89 (SC-62)

solder lands

solder resist

occupied area

solder paste

sot089_fr

1.2

1.9

2

2.25

4.75

1

(3

×)

0.7

(3

×)

0.6

(3

×)

1.1

(2

×)

1.2

0.85

0.2

0.5

1.7

4.85

3.95

4.6

1.5

1.5

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot089_fw

0.7

5.3

6.6

2.4

3.5

0.5

1.8

(2

×)

1.5

(2

×)

7.6

1.9

1.9

Dimensions in mm