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MUN2137T1G Datasheet(PDF) 2 Page - ON Semiconductor |
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MUN2137T1G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 12 page MUN2137, MMUN2137L, MUN5137, DTA144WE, DTA144WM3, NSBA144WF3 www.onsemi.com 2 Table 1. ORDERING INFORMATION Device Part Marking Package Shipping† MUN2137T1G 6P SC−59 (Pb−Free) 3000 / Tape & Reel MMUN2137LT1G ACD SOT−23 (Pb−Free) 3000 / Tape & Reel MUN5137T1G 6P SC−70/SOT−323 (Pb−Free) 3000 / Tape & Reel DTA144WET1G, NSVDTA144WET1G** 6P SC−75 (Pb−Free) 3000 / Tape & Reel DTA144WM3T5G 6P SOT−723 (Pb−Free) 8000 / Tape & Reel NSBA144WF3T5G D (90 °)* SOT−1123 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *(XX °) = Degree rotation in the clockwise direction. **S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. Figure 1. Derating Curve AMBIENT TEMPERATURE ( °C) 125 100 75 50 25 0 −25 −50 0 50 100 150 200 250 300 150 (1) (2) (3) (4) (5) (1) SC−75 and SC−70/SOT323; Minimum Pad (2) SC−59; Minimum Pad (3) SOT−23; Minimum Pad (4) SOT−1123; 100 mm2, 1 oz. copper trace (5) SOT−723; Minimum Pad Table 2. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit THERMAL CHARACTERISTICS (SC−59) (MUN2137) Total Device Dissipation TA = 25°C (Note 1) (Note 2) Derate above 25 °C (Note 1) (Note 2) PD 230 338 1.8 2.7 mW mW/ °C Thermal Resistance, (Note 1) Junction to Ambient (Note 2) RqJA 540 370 °C/W Thermal Resistance, (Note 1) Junction to Lead (Note 2) RqJL 264 287 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. FR−4 @ Minimum Pad. 2. FR−4 @ 1.0 x 1.0 Inch Pad. 3. FR−4 @ 100 mm2, 1 oz. copper traces, still air. 4. FR−4 @ 500 mm2, 1 oz. copper traces, still air. |
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