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SGL0622ZSQ Datasheet(PDF) 5 Page - RF Micro Devices |
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SGL0622ZSQ Datasheet(HTML) 5 Page - RF Micro Devices |
5 / 6 page 5 of 6 SGL0622Z DS140404 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Suggested Pad Layout Nominal Package Dimensions Dimensions in inches (millimeters) Refer to drawing posted at www.rfmd.com for tolerances. Part Identification Pin Function Description 1RF OUT/VD RF output and bias pin. Bias should be supplied to this pin through an external RF choke. (See application cir- cuit) 2GND Connect to ground per application circuit drawing. 3, 5, 6, 7, 8 N/A Not Used 4RF IN RF input pin. This pin requires the use of an external DC blocking capacitor as shown in the application schemat- ics. EPAD GND Exposed area on the bottom side of the package needs to be soldered to the ground plane of the board for ther- mal and RF performance. Vias should be located under the EPAD as shown in the recommended land pattern. Package Type: 2 x 2 QFN |
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