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SGL0622Z

DS140404

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Suggested Pad Layout

Nominal Package Dimensions

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

Part Identification

Pin

Function

Description

1RF OUT/VD

RF output and bias pin. Bias should be supplied to this pin through an external RF choke. (See application cir-

cuit)

2GND

Connect to ground per application circuit drawing.

3, 5,

6, 7, 8

N/A

Not Used

4RF IN

RF input pin. This pin requires the use of an external DC blocking capacitor as shown in the application schemat-

ics.

EPAD

GND

Exposed area on the bottom side of the package needs to be soldered to the ground plane of the board for ther-

mal and RF performance. Vias should be located under the EPAD as shown in the recommended land pattern.

Package Type:

2 x 2 QFN