ZXMN2A01F

Characteristic

Symbol

Value

Units

Drain-Source Voltage

20

V

Gate-Source Voltage

±12

V

(Note 6)

(Note 6)

(Note 5)

2.2

1.7

1.9

A

Pulsed Drain Current (Note 7)

8

A

Maximum Body Diode Continuous Current (Note 6)

1.29

A

Maximum Body Diode Continuous Current (Note 7)

8

A

Characteristic

Symbol

Value

Units

Total Power Dissipation

Linear Derating Factor

(Note 5)

625

mW

5

mW/°C

Total Power Dissipation

Linear Derating Factor

(Note 6)

806

mW

6.4

mW/°C

Thermal Resistance, Junction to Ambient

(Note 5)

200

°C/W

(Note 6)

155

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

5. For a device surface mounted on 25mm x 25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions.

7. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10

μs - pulse width limited by maximum junction temperature. Refer to Transient

Thermal Impedance graph.

ZXMN2A01F

Document number: DS33513 Rev. 4 - 2

2 of 7

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August 2014

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