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RT9167-35PB Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9167-35PB Datasheet(HTML) 9 Page - Richtek Technology Corporation |
9 / 10 page RT9167B 9 DS9167B-01 April 2011 www.richtek.com 8 packages, the thermal resistance, θJA, is 120°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA= 25 °C can be calculated by the following formula : PD(MAX) = (125 °C − 25°C) / (120°C/W) = 0.833W for MSOP-8 package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. For the RT9167B package, the derating curve in Figure 3 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Figure 3. Derating Curves for RT9167B Packages 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB |
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