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LTC3875 Datasheet(PDF) 4 Page - Linear Technology |
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LTC3875 Datasheet(HTML) 4 Page - Linear Technology |
4 / 44 page LTC3875 4 3875fa For more information www.linear.com/LTC3875 elecTrical characTerisTics The l denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 15V, VRUN1,2 = 5V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS TG/BG t1D Top Gate Off to Bottom Gate On Delay Synchronous Switch-On Delay Time CLOAD = 3300pF Each Driver 30 ns BG/TG t2D Bottom Gate Off to Top Gate On Delay Synchronous Switch-On Delay Time CLOAD = 3300pF Each Driver 30 ns tON(MIN) Minimum On-Time (Note 7) 90 ns INTVCC Linear Regulator VINTVCC Internal VCC Voltage 6V < VIN < 38V 5.3 5.5 5.7 V VLDO INT INTVCC Load Regulation ICC = 0mA to 20mA 0.5 2.0 % VEXTVCC EXTVCC Switchover Voltage EXTVCC Ramping Positive l 4.5 4.7 V VLDO EXT EXTVCC Voltage Drop ICC = 20mA, VEXTVCC = 5.5V 50 100 mV VLDOHYS EXTVCC Hysteresis 200 mV Oscillator and Phase-Locked Loop fNOM Nominal Frequency VFREQ = 1.2V 450 500 550 kHz fLOW Lowest Frequency VFREQ = 0V 220 250 270 kHz fHIGH Highest Frequency VFREQ ≥ 2.4V 650 720 790 kHz RMODE/PLLIN MODE/PLLIN Input Resistance 250 kΩ IFREQ Frequency Setting Current 9.5 10 10.5 µA CLKOUT Phase (Relative to Controller 1) PHASMD = GND PHASMD = FLOAT PHASMD = INTVCC 60 90 120 Deg Deg Deg CLK High Clock Output High Voltage VINTVCC = 5.5V 4.5 5.5 V CLK Low Clock Output Low Voltage 0.2 V VPGL PGOOD Voltage Low IPGOOD = 2mA 0.1 0.3 V IPGOOD PGOOD Leakage Current VPGOOD = 5.5V ±2 µA VPG PGOOD Trip Level, Either Controller VOSNS+ with Respect to Set Output Voltage VOSNS+ Ramping Negative VOSNS+ Ramping Positive –7.5 7.5 % % On-Chip Driver TG RUP TG Pull-Up RDS(ON) TG High 2.6 Ω TG RDOWN TG Pull-Down RDS(ON) TG Low 1.5 Ω BG RUP BG Pull-Up RDS(ON) BG High 2.4 Ω BG RDOWN BG Pull-Down RDS(ON) BG Low 1.1 Ω Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3875 is tested under pulsed load conditions such that TJ ≈ TA. The LTC3875E is guaranteed to meet specifications from 0°C to 85°C junction temperature. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LTC3875I is guaranteed over the full –40° to 125° operating junction temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance and other environmental factors. Note 3: TJ is calculated from the ambient temperature, TA, and power dissipation, PD, according to the formula: TJ = TA + (PD • 33°C/W) Note 4: The LTC3875 is tested in a feedback loop that servos VITH1,2 to a specified voltage and measures the resultant VOSNS1,2+. Note 5: Dynamic supply current is higher due to the gate charge being delivered at the switching frequency. See Applications Information. Note 6: Rise and fall times are measured using 10% and 90% levels. Delay times are measured using 50% levels. Note 7: The minimum on-time condition is specified for an inductor peak-to-peak ripple current ≥40% of IMAX (see Minimum On-Time Considerations in the Applications Information section). Note 8: Guaranteed by design. |
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