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LTC3774 Datasheet(PDF) 8 Page - Linear Technology |
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LTC3774 Datasheet(HTML) 8 Page - Linear Technology |
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8 / 38 page  LTC3774 8 3774fb For more information www.linear.com/LTC3774 pin FuncTions PGOOD1, PGOOD2 (Pin 15, Pin 14): Power Good Indica- tor Outputs. Open drain outputs that pull to ground when output voltage is not in regulation. SNSA1+, SNSA2+ (Pin 16, Pin 13): AC Current Sense Comparator (+) Inputs. This input senses the signal from the output inductor’s DCR with a filter bandwidth of five times larger than the inductor’s L/DCR value. SNS1–, SNS2– (Pin 17, Pin 12): Negative current Sense Inputs. The negative input of the current comparator is normally connected to the output. SNSD1+, SNSD2+ (Pin 18, Pin 11): DC Current Sense Comparator (+) Inputs. This input senses the signal from the output inductor’s DCR with a filter bandwidth equal to the inductor’s L/DCR value. RUN1, RUN2 (Pin 20, Pin 9): Run Control Inputs. A volt- age above 1.22V turns on the IC. There is a 1µA pull-up current on this pin. Once the RUN pin rises above the 1.22V threshold the pull-up increases to 5µA. PMW1, PWM2 (Pin 21, Pin 8): (Top) Gate Signal Outputs. This signal goes to the PWM or top gate input of the ex- ternal gate driver or integrated driver MOSFET or Power Block. This is a three-state compatible output. PWMEN1, PWMEN2 (Pin 22, Pin 7): Enable pins for non- three-state compatible drivers. This pin has an internal open-drain pull-up to INTVCC. An external resistor to GND is required. This pin is low when the corresponding PWM pin is high impedance. HIZB1, HIZB2 (Pin 23, Pin 6): Phase Shedding Input Pins. When this pin is low, the corresponding PWM pin goes high impedance and PWMEN goes low. Tie to INTVCC or VIN to disable this function. TK/SS1, TK/SS2 (Pin 24, Pin 5): Output Voltage Tracking and Soft-Start Inputs. The voltage ramp rate at this pin sets the voltage ramp rate of the output. A capacitor to ground accomplishes soft-start. This pin has a 1.25µA pull-up current. VOSNS1+, VOSNS2+ (Pin 25, Pin 4): Remote Sense Differ- entialAmplifierNon-invertingInputs.ConnecttoFeedback divider center tap with the divider across the output load. Theremotesensedifferentialamplifier’soutputisinternally connected to the error amplifier inverting input. VOSNS1–, VOSNS2– (Pin 26, Pin 3): Remote Sense Differ- ential Amplifier Inverting inputs. Connect to sense ground at the output load. ITH1, ITH2 (Pin 27, Pin 2): Current Control Thresholds and Error Amplifier Compensation Points. The current comparator’s threshold increases with the ITH control voltage. ITEMP1, ITEMP2 (Pin 28, Pin 1): Input of the temperature sensing comparators. Connect this pin to an external NTC resistorplacedneartheinductors.Floatingthispindisables the DCR temperature compensation function. ILIM1, ILIM2 (Pin 29, Pin 36): Current Comparator Sense Voltage Limit Selection pins. PHSMD (Pin 30): Phase Mode Pin. This pin selects CH1- CH2 and CH1-CLKOUT phase relationships. FREQ (Pin 31): Frequency Set/Select Pin. A resistor between this pin and GND sets the switching frequency. This pin sources 20uA. MODE/PLLIN (Pin 32): Dual Function Pin. Tying this pin to GND, INTVCC or floating it enables forced continuous mode, pulse-skipping mode or Burst Mode operation re- spectively. Applying a clock signal to this pin causes the internal PLL to synchronize the internal oscillator to the clock signal and forces forced continuous mode. The PLL compensation network is integrated on to the IC. CLKOUT (Pin 33): Clock Output Pin. This pin is used to synchronize other LTC3774s. INTVCC (Pin 34): Internal 5.5V Regulator Output. The con- trol circuits are powered from this voltage. Decouple this pin to GND with a minimum of 4.7µF low ESR tantalum or ceramic capacitor. This pin is intended to be used as a reference only. Please do not bias other applications off this voltage! VIN (Pin 35): Main Input Supply. Decouple this pin to GND with a capacitor (0.1µF to 1µF) GND (Pins 19, 10, Exposed Pad Pin 37): Ground. All small-signal components and compensation components should be connected here. The exposed pad must be soldered to the PCB ground for electrical connection and rated thermal performance. |
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Similar Description - LTC3774_15 |
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