LTM8057_15 datasheet(2/20 Pages) LINER

Part #	LTM8057

Description	3.1VIN to 31VIN Isolated Module DC/DC Converter

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Manufacturer	LINER [Linear Technology]

Direct Link	http://www.linear.com

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LTM8057

2

8057f

For more information www.linear.com/LTM8057

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, RUN, BIAS ........................................................32V

ADJ, SS.......................................................................5V

VOUT1 Relative to VOUT– ............................................16V

VIN + VOUT (Note 2)...................................................36V

BIAS Above VIN........................................................ 0.1V

GND to VOUT– Isolation (Note 3) ......................... 2kV AC

Maximum Internal Temperature (Note 4) .............. 125°C

Peak Solder Reflow Body Temperature ................. 245°C

Storage Temperature.............................. –55°C to 125°C

(Note 1)

TOP VIEW

H

G

F

E

D

C

B

A

1

2

3

4

5

6

7

BANK 2

VOUT–

BANK 1

VOUT

BANK 4

GND

BIAS

RUN

ADJ

SS

BANK 5

VIN

BGA PACKAGE

38-LEAD (11.25mm

× 9mm × 4.92mm)

TJMAX = 125°C, θJA = 16°C/W, θJCbottom = 4.1°C/W, θJCtop = 15°C/W, θJB = 4°C/W

WEIGHT = 1.1g,

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE (SEE NOTE 4)

DEVICE

CODE

LTM8057EY#PBF

SAC305 (RoHS)

LTM8057Y

e1

BGA

3

–40°C to 125°C

LTM8057IY#PBF

SAC305 (RoHS)

LTM8057Y

e1

BGA

3

–40°C to 125°C

LTM8057IY

SnPb (63/37)

LTM8057Y

e0

BGA

3

–40°C to 125°C

LTM8057MPY#PBF

SAC305 (RoHS)

LTM8057Y

e1

BGA

3

–55°C to 125°C

LTM8057MPY

SnPb (63/37)

LTM8057Y

e0

BGA

3

–55°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

www.linear.com/packaging

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