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RFPA5522PCK-410 Datasheet(PDF) 9 Page - RF Micro Devices |
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RFPA5522PCK-410 Datasheet(HTML) 9 Page - RF Micro Devices |
9 / 9 page 9 of 9 RFPA5522 RFMD + TriQuint = Qorvo Pin Names and Descriptions Pin Name Description 1 NC Not connected internally. It may be left floating or connected to ground. 2 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 3 RFIN RF inp ut, internally matched to 50Ω and DC shorted. External DC blocking capacitor required. 4 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 5 PA_EN PA Enable pin. Apply <0.4VDC. Apply 1.5VDC to VCC to enable PA. 6 RC1 Tuning RC pin 1. See EVB schematic for details. 7 RC2 Tuning RC pin 2. See EVB schematic for details. 8 NC Not connected internally. It may be left floating or connected to ground. 9 NC Not connected internally. It may be left floating or connected to ground. 10 PDET Power detector. Provides an output voltage proportional to the RF output power level. 11 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 12 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 13 RFOUT RF outp ut, internally matched to 50Ω and DC shorted. External DC blocking capacitor required. 14 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 15 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 16 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 17 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 18 VCC3 Third stage supply voltage 19 VCC2 Second stage supply voltage. 20 VCC1 First stage supply voltage. Pkg Base GND Ground connection. The back side of the package should be connected to the ground plan though as short of a connection as possible. PCB vias under the device are recommended. Revision DS20150303 Disclaimer: Subject to change without notice © 2015 RF Micro Devices, Inc. www.rfmd.com / www.qorvo.com |
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