RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS141006

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

6 of 8

RFCM3316

Evaluation Board Schematic

C8

4.7nF

C3

4.7nF

R5

470

Ω

R6

470

Ω

C6

4.7nF

C5

1.2pF

C4

1.2pF

R2

3k

Ω

R3

1.5k

Ω

R4

10

Ω

C2

4.7nF

C10

0.5pF

D2

MM3Z5V6T1

R1

5.1k

Ω

D1

TGL34-33A

C1

220pF

C7

4.7nF

U1

RFCM3316

1

2

3

4

9

8

7

6

5

FB1

Bead 60

Ω

T2

RFXF0008

V+

GND

RF IN

RF OUT

R7

DNI

R8

DNI

R9

DNI

C9

DNI

C12

DNI

R10

DNI

R11

DNI

R12

DNI

C11

0.5pF

Vt

C13

4.7nF

T1

RFXF0006

T3

RFXF0009

R13

3.3k

Ω

Evaluation Board Assembly Drawing

Note:

The ground plane of the RFCM3316 module should be soldered onto a board equipped with as many thermal vias as possible.

Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete

module DC power (up to 10.4 Watts). In any case the module backside temperature should not exceed 110°C.