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RF5603

DS120213

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3

inch

to 8

inch gold over 180inch nickel.

PCB Land Pattern Recommendation

PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown

has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate

lead and package tolerances. Since surface mount processes vary from company to company, careful process development is

recommended.

PCB Metal Land and Solder Mask Pattern

Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will depend

on the application, the power dissipation, and the electrical requirements. Example of the number and size of vias can be

found on the RFMD evaluation board layout.