RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS131004

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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NBB-310

Sales Criteria

– Unpackaged Die

Die Sales Information



All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be negotiated

on a case-by-case basis.



Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product Final

Visual Inspection Criteria



Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allowable.

Die Packaging



All die are packaged in GelPak ESD protective containers with the following specification: O.D. = 2"X2", Capacity = 400

Die (20X20 segments), Retention Level = High(X0).



GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is opened the

GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed GelPak, handle by

the edges only. Do not vacuum seal bags containing GelPak containers.



Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit

Package Storage



Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.



Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit

Die Handling



Proper ESD precautions must be taken when handling die material.



Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of tweezers. Do

not touch die with any part of the body.



When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force

may damage GaAs devices.

Die Attach



The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die

attach processes electrically connect the ground to the trace on which the chip is mounted. It also establishes the thermal

path by which heat can leave the chip.



Die should be mounted to a clean, flat surface. Epoxy or eutectic die attach are both acceptable attachment methods. Top

and bottom metallization are gold. Conductive silver-filled epoxies are recommended. This procedure involves the use of

epoxy to form a joint between the backside gold of the chip and the metallized area of the substrate.



All connections should be made on the topside of the die. It is essential to performance that the backside be well

grounded and that the length of topside interconnects be minimized.



Some die utilize vias for effective grounding. Care must be exercised when mounting die to preclude excess run-out on

the topside.

Die Wire Bonding



Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable

practices for wire bonding.



All bond wires should be made as short as possible.

Notes

personnel to determine final visual acceptance of die product prior to shipping to customers.

material shift. However, due to the physical size of die-level product, RFMD does not guarantee that material will not shift during

transit, especially under extreme handling circumstances. Product replacement due to material shift will be at the discretion

of RFMD.