µPG110P

7

1. 100 % Tests

1-1 100 % DC Probe

1-2

Visual Inspection

MIL-STD-883 Method 2010

Condition B

2. Tests on Sampling Basis

2-1 Bond Pull Tests (In case of recommended chip handling)

MIL-STD-883 Method 2011

5 samples/wafer and 20 points tested

Accept 0/Reject 1

2-2

Tests in Standard Package

Test the electrical characteristics of chips assembled into the standard package used for

µPG110B

5 samples/wafer tested

DC and RF measurement Accept 1/Reject 2

3. Warrantee

NEC has a responsibility of quality assurance for the products within 180 days after delivered to customers where these

4. Caution

4-1 Take great care to prevent static electricity.