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UPD75P308GF-001-3B9 Datasheet(PDF) 10 Page - NEC

Part # UPD75P308GF-001-3B9
Description  4-BIT SINGLE-CHIP MICROCOMPUTER
Download  34 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPD75P308GF-001-3B9 Datasheet(HTML) 10 Page - NEC

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µPD75P308
10
Item
µPD75P308K
µPD75P308GF
µPD75308GF
• EPROM
• PROM (one-time model)
• Mask ROM
• 0000H-1F7FH
• 0000H-1F7FH
• 0000H-1F7FH
• 8064 x 8 bits
• 8064 x 8 bits
• 8064 x 8 bits
Pull-up Resistor
Ports 4, 5
Dividing Resistor for LCD
Driving Power Supply
Pins 50-53
P30/MD0-P33/MD3
P30-P33
Pin 57
VPP
NC
Current dissipations and operating temperature ranges differ between
µPD75P308 and
µPD75308. For detail, refer to the specification documents of each mode.
Operating Voltage Range
5V
±5%
2.7-6.0V
80-pin ceramic WQFN
(LCC w/window)
Noise immunity and noise radiation differ because circuit scale and mask layout are
different.
2. DIFFERENCES BETWEEN
µPD75P308 AND µPD75308
The
µPD75P308 is a model of the µPD75308 and is equipped with a PROM instead of a mask ROM.
Programs can be rewritten to the PROM of the
µPD75P308. Table 2-1 shows the differences between the
µPD75P308 and µPD75308. You should fully consider these differences when you debug or produce your
application system on an experimental basis by using the PROM model, and then proceed to mass-produce
the system by using the mask ROM model.
For the details of the CPU and the internal hardware, refer to
µPD75308 User's Manual (IEM-5016).
Table 2-1 Differences between
µPD75P308 and µPD75308
Program Memory
5
5
Note:
The noise immunity and noise radiation differ between the PROM and mask ROM models. To replace
the PROM model with the mask ROM model in the course of experimental production to mass
production, evaluate your system by using the CS mode (not ES model) of the mask ROM model.
Pin Connection
Not provided
Mask option
Not provided
Mask option
Electrical Specifications
Package
Others
80-pin plastic QFP (14 x 20 mm)
5


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