MMDT5451

COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

•

Complementary Pair

One 5551-Type NPN

One 5401-Type PNP

DS30171 Rev. 9 - 2

1 of 5

www.diodes.com

MMDT5451

© Diodes Incorporated

•

Epitaxial Planar Die Construction

•

Ideal for Medium Power Amplification and Switching

•

Ultra-Small Surface Mount Package

•

Lead Free/RoHS Compliant (Note 3)

•

"Green" Device (Note 4 and 5)

Mechanical Data

•

Case: SOT-363

•

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Solderable per MIL-STD-202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

•

Terminal Connections: See Diagram

•

Marking Information: KNM, See Page 5

•

Ordering & Date Code Information: See Page 5

•

Weight: 0.006 grams (approximate)

SOT-363

Dim

Min

Max

A

0.10

0.30

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

F

0.30

0.40

H

1.80

2.20

J

—

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.25

α

0°

8°

All Dimens

mm

ions in

A

M

J

L

D

B C

H

K

G

F

C

1

B

2

B

1

E1, B1, C1 = PNP5401 Section

E2, B2, C2 = NPN5551 Section

Characteristic

Symbol

NPN5551

Unit

Collector-Base Voltage

180

V

Collector-Emitter Voltage

160

V

Emitter-Base Voltage

6.0

V

Collector Current - Continuous

(Note 1)

200

mA

Power Dissipation

(Note 1, 2)

200

mW

Thermal Resistance, Junction to Ambient

(Note 1)

625

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Characteristic

Symbol

PNP5401

Unit

Collector-Base Voltage

-160

V

Collector-Emitter Voltage

-150

V

Emitter-Base Voltage

-5.0

V

Collector Current – Continuous

(Note 1)

-200

mA

Power Dissipation

(Note 1, 2)

200

mW

Thermal Resistance, Junction to Ambient

(Note 1)

625

K/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Maximum combined dissipation.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.