µPD75P0116

3

TABLE OF CONTENTS

1.

PIN CONFIGURATION (Top View) .................................................................................................... 4

2.

BLOCK DIAGRAM ............................................................................................................................. 6

3.

PIN FUNCTIONS ................................................................................................................................ 7

3.1

Port Pins ..................................................................................................................................................... 7

3.2

Non-port Pins ............................................................................................................................................. 8

3.3

I/O Circuits for Pins ................................................................................................................................... 9

3.4

Handling of Unused Pins ........................................................................................................................ 11

4.

SWITCHING BETWEEN MK I AND MK II MODES .......................................................................... 12

4.1

Differences between Mk I Mode and Mk II Mode ................................................................................... 12

4.2

Setting of Stack Bank Selection (SBS) Register ................................................................................... 13

5.

DIFFERENCES BETWEEN

µPD75P0116 AND µPD750104, 750106, AND 750108 ...................... 14

6.

MEMORY CONFIGURATION ........................................................................................................... 15

7.

INSTRUCTION SET .......................................................................................................................... 17

8.

ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ................................................... 28

8.1

Operation Modes for Program Memory Write/Verify ............................................................................ 28

8.2

Steps in Program Memory Write Operation .......................................................................................... 29

8.3

Steps in Program Memory Read Operation ........................................................................................... 30

8.4

One-Time PROM Screening .................................................................................................................... 31

9.

ELECTRICAL SPECIFICATIONS ..................................................................................................... 32

10. CHARACTERISTIC CURVES (REFERENCE VALUE) .................................................................... 46

11. RC OSCILLATION FREQUENCY CHARACTERISTICS EXAMPLES (REFERENCE VALUE) ...... 47

12. PACKAGE DRAWINGS .................................................................................................................... 49

13. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 51

APPENDIX A. FUNCTION LIST OF

µPD750008, 750108, AND 75P0116 ............................................. 52

APPENDIX B. DEVELOPMENT TOOLS ................................................................................................. 54

APPENDIX C. RELATED DOCUMENTS ................................................................................................ 58