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LT1086CT-3.3 Datasheet(PDF) 11 Page - Linear Technology |
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LT1086CT-3.3 Datasheet(HTML) 11 Page - Linear Technology |
11 / 16 page 11 LT1086 Series APPLICATIONS INFORMATION In all cases proper mounting is required to ensure the best possible heat flow from the die to the heat sink. Thermal compound at the case-to-heat sink interface is strongly recommended. In the case of the H package, mounting the device so that heat can flow out the bottom of the case will significantly lower thermal resistance ( ≈ a factor of 2). If the case of the device must be electrically isolated, a thermally conductive spacer can be used as long as its added contribution to thermal resistance is considered. Note that the case of all devices in this series is electrically connected to the output. In both cases the junction temperature is below the maximum rating for the respective sections, ensuring reliable operation. Junction-to-case thermal resistance for the K and T pack- ages is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. While this is also the lowest resistance path for the H package, most available heat sinks for this package are of the clip-on type that attach to the cap of the package. The data sheet specification for thermal resis- tance for the H package is therefore written to reflect this. SCSI-2 Active Termination TYPICAL APPLICATIONS 5V, 1.5A Regulator 10 µF TANTALUM 4.25V TO 5.25V 1N5817 TERMPWR LT1086 • TA03 10 µF TANTALUM 0.1 µF CERAMIC 18 TOTAL 110 Ω 2% 110 Ω 110 Ω 110 Ω 110 Ω 2% 110 Ω 2% LT1086-2.85 IN OUT GND + + VIN ≥ 6.5V 5V AT 1.5A *REQUIRED FOR STABILITY LT1086 LT1086 • AI02 10 µF* TANTALUM 121 Ω 1% 365 Ω 1% 10 µF IN OUT ADJ + + |
Similar Part No. - LT1086CT-3.3 |
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Similar Description - LT1086CT-3.3 |
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