11

LT1019

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

N8 Package

8-Lead PDIP (Narrow 0.300)

(LTC DWG # 05-08-1510)

S8 Package

8-Lead Plastic Small Outline (Narrow 0.150)

(LTC DWG # 05-08-1610)

H Package

8-Lead TO-5 Metal Can (0.200 PCD)

(LTC DWG # 05-08-1320)

N8 1098

0.100

(2.54)

BSC

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.130

± 0.005

(3.302

± 0.127)

0.020

(0.508)

MIN

0.018

± 0.003

(0.457

± 0.076)

0.125

(3.175)

MIN

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.325

(7.620 – 8.255)

0.325

+0.035

–0.015

+0.889

–0.381

8.255

()

12

3

4

87

6

5

0.255

± 0.015*

(6.477

± 0.381)

0.400*

(10.160)

MAX

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)

0.016 – 0.050

(0.406 – 1.270)

0.010 – 0.020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

0.008 – 0.010

(0.203 – 0.254)

SO8 1298

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

TYP

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

1

2

3

4

0.150 – 0.157**

(3.810 – 3.988)

8

7

6

5

0.189 – 0.197*

(4.801 – 5.004)

0.228 – 0.244

(5.791 – 6.197)

DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

*

**

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.200

(5.080)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8(TO-5) 0.200 PCD 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1