11

LTC3423/LTC3424

34234f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661)

MSOP (MS) 1001

0.53

± 0.01

(.021

± .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

0.13

± 0.05

(.005

± .002)

0.86

(.034)

REF

0.50

(.0197)

TYP

12 3 45

4.88

± 0.10

(.192

± .004)

0.497

± 0.076

(.0196

± .003)

REF

8

9

10

7 6

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

NOTE 4

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.2 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

3.05

± 0.38

(.0120

± .0015)

TYP

0.50

(.0197)

BSC

6

10

3

2

1

LTC3423

SHDN

MODE/SYNC

SW

FB

GND

4

7

8

9

5

C4

470pF

C2

4.7

µF

82k

30.1k

R1

110k

R2

249k

L1

4.7

µH

D1

C3

22

µF

C1: TAIYO YUDEN JMK212BJ225MG

C2: TAIYO YUDEN JMK212BJ475MM

C3: TAIYO YUDEN JMK325BJ226MM

D1: ON SEMICONDUCTOR MBRM120T3

L1: SUMIDA CDRH3D16-4R7M

0 = FIXED FREQ

1 = Burst Mode OPERATION

C5

4.7pF

3423/24 TA04

1.8V

300mA

1

CELL

IN

+

–

C1

2.2

µF

TYPICAL APPLICATIO

Single Cell to 1.8V at 300mA, 1.8mm High

PACKAGE DESCRIPTIO