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LTC3406AB-2 Datasheet(PDF) 10 Page - Linear Technology

Part # LTC3406AB-2
Description  2.25MHz, 600mA Synchronous Step-Down Regulator in ThinSOT
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC3406AB-2 Datasheet(HTML) 10 Page - Linear Technology

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LTC3406AB-2
10
3406ab2f
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of
the losses in LTC3406AB-2 circuits: VIN quiescent current
and I2R losses. The VIN quiescent current loss dominates
the efficiency loss at very low load currents whereas the
I2R loss dominates the efficiency loss at medium to high
load currents. In a typical efficiency plot, the efficiency
curve at very low load currents can be misleading since
the actual power lost is of no consequence as illustrated
in Figure 2.
2. I2R losses are calculated from the resistances of the
internal switches, RSW, and external inductor RL. In
continuous mode, the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET RDS(ON) and the duty cycle
(DC) as follows:
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)
The RDS(ON)forboththetopandbottomMOSFETscanbe
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I2R losses, simply add RSW to
RL and multiply the result by the square of the average
output current.
Other losses including CIN and COUT ESR dissipative losses
and inductor core losses generally account for less than
2% total additional loss.
Thermal Considerations
In most applications the LTC3406AB-2 does not dissipate
much heat due to its high efficiency. But, in applications
where the LTC3406AB-2 is running at high ambient tem-
perature with low supply voltage and high duty cycles,
such as in dropout, the heat dissipated may exceed the
maximum junction temperature of the part. If the junction
temperature reaches approximately 150°C, both power
switches will be turned off and the SW node will become
high impedance.
To avoid the LTC3406AB-2 from exceeding the maximum
junction temperature, the user will need to do some thermal
analysis. The goal of the thermal analysis is to determine
whether the power dissipated exceeds the maximum
junction temperature of the part. The temperature rise is
given by:
TR = (PD)(θJA)
where PD is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to
the ambient temperature.
APPLICATIONS INFORMATION
Figure 2. Power Loss vs Load Current
1. The VIN quiescent current is due to two components:
the DC bias current as given in the electrical charac-
teristics and the internal main switch and synchronous
switch gate charge currents. The gate charge current
results from switching the gate capacitance of the
internal power MOSFET switches. Each time the gate
is switched from high to low to high again, a packet of
charge, dQ, moves from VIN to ground. The resulting
dQ/dt is the current out of VIN that is typically larger
than the DC bias current. In continuous mode, IGATECHG
= f(QT + QB) where QT and QB are the gate charges of
the internal top and bottom switches. Both the DC bias
and gate charge losses are proportional to VIN and thus
their effects will be more pronounced at higher supply
voltages.
OUTPUT CURRENT (mA)
0.001
0.01
0.1
1
0.1
10
100
1000
3406AB2 F02
0.0001
1
VIN = 3.6V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V


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