DFM500XXM65-TS000

2/6

www.dynexsemi.com

ABSOLUTE MAXIMUM RATINGS

Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In

extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.

Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect

device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

Repetitive peak reverse voltage

6500

V

6300

V

5800

V

Forward current (per arm)

500

A

Max. forward current

1000

A

I

I

100

kA

Max. power dissipation

3300

W

Isolation voltage

– per module

Commoned terminals to base plate.

AC RMS, 1 min, 50Hz

10.2

kV

Partial discharge

– per module

10

pC

THERMAL AND MECHANICAL RATINGS

Internal insulation material:

AlN

Baseplate material:

AlSiC

Creepage distance:

56mm

Clearance:

26mm

CTI (Comparative Tracking Index):

> 600

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Units

Thermal resistance (per arm)

Continuous dissipation

–

junction to case

-

-

30

°C/kW

Thermal resistance

–

case to heatsink (per module)

Mounting torque 5Nm

(with mounting grease)

-

-

8

°C/kW

Junction temperature

-40

-

150

°C

Storage temperature range

-40

-

150

°C

Screw Torque

Mounting

– M6

-

-

5

Nm

Electrical connections

– M8

-

-

10

Nm