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INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY

Figure 7. Description of The Assembly Process

Wires thinner than a human hair (for microcontrollers the typical value is 33 microns) are re-

quired to connect chips to the external world and enable electronic signals to be fed through

the chip. The process of connecting these thin wires from the chip’s bond pads to the package

lead is called wire bonding (see also graph on next page for more details).

Figure 8. Wire Bonding