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TN0107 Datasheet(PDF) 11 Page - STMicroelectronics |
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TN0107 Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 15 page DocID15852 Rev 3 11/15 TN0107 Reflow 15 3.3 Pin-in-paste Another technique used to solder THDs is to print solder paste onto a PCB near or over drill holes through which the leads are then inserted. The reflow of the solder paste is done together with soldering the SMDs, which therefore have to go through the reflow temperature profile. This has two consequences: 1. The temperature is nearly the same for the whole package in contrast to wave soldering. 2. The time for which the peak temperature is applied to the package is much longer compared to wave soldering. THDs are qualified for wave soldering and not for reflow soldering. Therefore, pin-in-paste soldering techniques are not recommended for the SLLIMM. 3.4 Heatsink mounting by reflow soldering In special applications the heatsinks of high-power THDs can be mounted to the board by solder paste printing, pick-and-place, and reflow soldering. In this case, the packages undergo a reflow profile. THDs are qualified for wave soldering and not for the reflow soldering. Therefore, reflow soldering should not be used for the heatsink mounting for the SLLIMM. |
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