LT1118/LT1118-2.5

LT1118-2.85/LT1118-5

7

1118fd

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

ST Package

3-Lead Plastic SOT-223

(Reference LTC DWG # 05-08-1630)

S8 Package

8-Lead Plastic Small Outline (Narrow 0.150)

(Reference LTC DWG # 05-08-1610)

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

.114 – .124

(2.90 – 3.15)

.248 – .264

(6.30 – 6.71)

.130 – .146

(3.30 – 3.71)

.264 – .287

(6.70 – 7.30)

.0905

(2.30)

BSC

.033 – .041

(0.84 – 1.04)

.181

(4.60)

BSC

.024 – .033

(0.60 – 0.84)

.071

(1.80)

MAX

10

°

MAX

.012

(0.31)

MIN

.0008 – .0040

(0.0203 – 0.1016)

10

° – 16°

.010 – .014

(0.25 – 0.36)

10

° – 16°

RECOMMENDED SOLDER PAD LAYOUT

ST3 (SOT-233) 0502

.129 MAX

.059 MAX

.059 MAX

.181 MAX

.039 MAX

.248 BSC

.090

BSC