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LT1118 Datasheet(PDF) 6 Page - Linear Technology |
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LT1118 Datasheet(HTML) 6 Page - Linear Technology |
6 / 8 page LT1118/LT1118-2.5/ LT1118-2.85/LT1118-5 6 1118fd OPERATION SCSI Active Terminator connected to the die substrate. Table 1 shows measured thermal resistance from junction to ambient for the LT1118 connected to various sized PC board ground planes. The power dissipated in the LT1118 varies with input voltage and loading. When the regulator is sourcing current the power which must be dissipated by the package is: PD = (VIN – VOUT) • ILOAD When the regulator is sinking load current, power dissipa- tion is nearly independent of VIN and can be calculated as: PD = VOUT • ILOAD Heat sinking to the IC package must consider the worst case power dissipation which may occur. Table 1. Measured Thermal Resistance from Junction to Ambient for the LT1118 S8 Package SOT-223 Free Air 1 Sq Inch Copper 120°C/W 55°C/W 95°C/W 53°C/W 4 Sq Inch Copper 35°C/W 38°C/W TYPICAL APPLICATIONS Power Supply Splitter LT1118-2.85 GND IN 27 LINES 2.2μF 5V 1μF 110Ω 110Ω 1118 TA03 110Ω 110Ω 110Ω TERMPWR OUT • • • • • • • • + LT1118-2.5 GND IN 1μF 1118 TA04 5V ANALOG COMMON 2.5V VIN 5V OUT 1μF |
Similar Part No. - LT1118_15 |
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Similar Description - LT1118_15 |
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