LT1118/LT1118-2.5/

LT1118-2.85/LT1118-5

6

1118fd

OPERATION

SCSI Active Terminator

connected to the die substrate. Table 1 shows measured

thermal resistance from junction to ambient for the LT1118

connected to various sized PC board ground planes. The

power dissipated in the LT1118 varies with input voltage

and loading. When the regulator is sourcing current the

power which must be dissipated by the package is:

When the regulator is sinking load current, power dissipa-

as:

Heat sinking to the IC package must consider the worst

case power dissipation which may occur.

Table 1. Measured Thermal Resistance from Junction to Ambient

for the LT1118

S8 Package

SOT-223

Free Air

1 Sq Inch Copper

120°C/W

55°C/W

95°C/W

53°C/W

4 Sq Inch Copper

35°C/W

38°C/W

TYPICAL APPLICATIONS

Power Supply Splitter

LT1118-2.85

GND

IN

27 LINES

2.2μF

5V

1μF

110Ω

110Ω

1118 TA03

110Ω

110Ω

110Ω

TERMPWR

OUT

•

•

•

•

•

•

•

•

+

LT1118-2.5

GND

IN

1μF

1118 TA04

5V

ANALOG

COMMON

2.5V

5V

OUT

1μF