High Power PIN Diode

50 MHz - 12 GHz

Rev. V1

MADP-011029-14150T

3

3

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macomtech.com for additional data sheets and product information.

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3

PCB Layout

PCB Schematic

12. R1 is not needed when using the recommended ferrite FB1.

13. Max DC voltage with recommended components not to

exceed 100 V.

Part

Value

Case Style

C1

62 pF

0402

C2, C3

100 pF

0402

FB1

470 Ω @ 1 GHz

0402

R1

150 Ω

0402

L1

82 nH

0402

Devices

may

be

soldered

using

standard

Pb60/Sn40, or RoHS compliant solders. Leads

are plated NiPdAuAg to ensure an optimum

solderable connection.

For recommended Sn/Pb and RoHS soldering

profile See Application Note M538 on the MACOM

website.

Assembly Recommendations

Cleanliness and Storage

These devices should be handled and stored in a

clean environment. Ends of the device are

NiPdAuAg plated for greater solderability. Exposure

to high humidity (>80%) for extended periods may

cause the surface to oxidize. Caution should be

taken when storing devices for long periods.

General Handling

Device can be handled with tweezers or vacuum

pickups and are suitable for use with automatic

pick-and-place equipment.