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MADP-000504-10720T Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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MADP-000504-10720T Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 6 page • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 Non Magnetic MELF PIN Diode V1 MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Description M/A-COM Technology Solutions product line of MELF, PIN diodes, encompass a comprehensive range of electrical characteristics. The chip used in the MADP-000504-10720T is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. This packaged, CERMACHIP, PIN diode is ideally suited for use in applications where high RF and DC voltages are present. The chip is enclosed in a rugged, ceramic, Metal Electrode Leadless Faced (MELF), surface mount package that is full face bonded to refractory metal plugs on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed specifically for high volume tape and reel assembly. Their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. All solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase soldering processes. Features • High Power Handling • Low Loss / Low Distortion • Leadless Low Inductance MELF Package • Non-Magnetic • Surface Mountable • RoHS Compliant • MSL 1 Applications The MADP-000504-10720T MELF is well suited for use in low loss, low distortion, UHF and VHF high power switching circuits. It is specifically designed to operate in high magnetic fields and to tune or protect RF coils in MRI circuits. This device is designed to meet the most demanding electrical and mechanical environments. Parameter Absolute Maximum Forward Voltage1,2 1.0 V Reverse Voltage1,2 500V Operating Temperature -65°C to +175°C Storage Temperature -65°C to +200°C Mounting Temperature +260°C for 30 seconds Absolute Maximum Ratings @ 25°C 1. Exceeding these limits may cause permanent damage to the device. 2. Values will de-rate linearly over temperature. Package Style 1072 Dot Denotes Cathode Ordering Information Part Number Packaging MADP-000504-10720T Tape and reel Quantity 1500 pcs Tape and reel information can be found in Application Note M513 on the M/A-COM website |
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