4

RoHS Compliant

Rev. V2

MADP-042XX8-13060 Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Handling Procedures

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The

use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should

insure that abrasion and mechanical shock are minimized.

Bonding Techniques

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently

located on the bottom surface of these devices and are removed from the active junction locations. These devices are well

suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is

recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per

manufacturers recommended time and temperature. Typically 1 hour at 150°C.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of

60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it

is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads

are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,

apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a

time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat

to flow through the top

surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads

can be visually inspected through the die after attachment is completed.

Ordering Information

The MADP-042XX8-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the

.

Part Number

Gel Pack

Tape and Reel (Pocket Tape)

MADP-042308-13060G

MADP-042308-13060P

MADP-042408-13060G

MADP-042408-13060P

MADP-042508-13060G

MADP-042508-13060P

MADP-042908-13060G

MADP-042908-13060P