TQP3M9038

High-Linearity LNA Gain Block

Datasheet: Rev D 08-06-13

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Disclaimer: Subject to change without notice

© 2013 TriQuint

www.triquint.com

Mechanical Information

Package Marking and Dimensions

Marking: Part number – 9038

Date Code – YYWW

Assembly Code – aXXXX

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally

enhanced plastic very thin fine pitch quad flat no lead package (QFN).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

PCB Mounting Pattern

Pin 1 Locator

COMPONENT SIDE

7X 3

16X 0.32

0.50 Pitch 16X

16X 0.52

1.50

1.50

Package Outline

0.31

0.09

0.55

0.32

0.64

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

Top View

Side View

Bottom View

3.00±0.05

3.00±0.05

.20 Ref.

0.000-0.050

PIN #1 IDENTIFICATION

CHAMFER 0.300 X 45°

1.70±0.05 Exp.DAP

0.23±0.05

0.50 Bsc

1.50

Ref.

1.70±0.05 Exp.DAP

0.85±0.05

Pin 1 Locator

GND/Thermal Pad

0.38±0.05

9038

YYWW

aXXXX