TQC9312

3.3 – 3.8 GHz ½

 W Digital Variable Gain Amplifier

Package Marking and Dimensions

Marking: Part number – TQC9312

Year/week code – YYWW CCCC

Assembly code– AaXXXX

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin profile, fine

pitch, internal stacking module (ISM).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.

6. Package body length/width does not include plastic flash protrusion across mold parting line.

PCB Mounting Pattern

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

.10 C

2X

.10 C

2X

(1X) shape

0.10

C A B

(28X) 0.450x X 0.400y

0.10

C A B

GND/THERMAL PAD

5

.10 C

.08 C

SEATING PLANE

28X

5

6.0±0.1

6.0±0.1

2.10

2.10

5.35

28X 0.10

2.10

2.10

1.02±0.08

C

0.70

28X 0.70 Pitch

0.70

4

TERMINAL #1

IDENTIFIER

4

TERMINAL #1

IDENTIFIER

TQC9312

YYWW CCCC

AaXXXX

Datasheet: Rev C 12-04-1

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Disclaimer: Subject to change without notice

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