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TGC4703-FC Datasheet(PDF) 11 Page - TriQuint Semiconductor

Part # TGC4703-FC
Description  19 to 38 GHz Doubler
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Manufacturer  TRIQUINT [TriQuint Semiconductor]
Direct Link  http://www.triquint.com
Logo TRIQUINT - TriQuint Semiconductor

TGC4703-FC Datasheet(HTML) 11 Page - TriQuint Semiconductor

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TGC4703-FC
November 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Assembly Notes
Ordering Information
Part
Package Style
TGC4703-FC
GaAs MMIC Die
Process
Sn Reflow
Ramp-up Rate
3 0C/sec
Flux Activation Time and Temperature
60 – 120 sec @ 140 – 160 0C
Time above Melting Point (245 0C)
60 – 150 sec
Max Peak Temperature
300 0C
Time within 5 0C of Peak Temperature
10 – 20 sec
Ramp-down Rate
4 – 6 0C/sec
Typical Reflow Profiles for TriQuint Cu / Sn Pillars
Component placement and die attach assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• Cu pillars on die are 65 um tall with a 22 um tall Sn solder cap.
• Recommended board metallization is evaporated TiW followed by nickel/gold at pillar attach interface. Ni is the adhesion layer for
the solder and the gold keeps the Ni from oxidizing. The Au should be kept to a minimum to avoid embrittlement; suggested Au /
Sn mass ratio must not exceed 8%.
• Au metallization is not recommended on traces due to solder wicking and consumption concerns. If Au traces are used, a physical
solder barrier must be applied or designed into the pad area of the board. The barrier must be sufficient to keep the solder from
undercutting the barrier.
Reflow process assembly notes:
• Minimum alloying temperatures 245 0C.
• Repeating reflow cycles is not recommended due to Sn consumption on the first reflow cycle.
• An alloy station or conveyor furnace with an inert atmosphere such as N2 should be used.
• Dip copper pillars in “no-clean flip chip” flux prior to solder attach. Suggest using a high temperature flux. Avoid exposing entire
die to flux.
• If screen printing flux, use small apertures and minimize volume of flux applied.
• Coefficient of thermal expansion matching between the MMIC and the substrate/board is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
• Suggested reflow will depend on board material and density.


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