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TGA4916 Datasheet(PDF) 10 Page - TriQuint Semiconductor |
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TGA4916 Datasheet(HTML) 10 Page - TriQuint Semiconductor |
10 / 12 page TGA4916 Mechanical Drawing 14 11 2 5 10 1 6 12 7 3 4 13 8 9 10 Sept 2010 © Rev C TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Units: millimeters Thickness: 0.05 Die x,y size tolerance: +/- 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad #1 RF Input 0.125 x 0.20 Bond Pad #8 Vd_2_top_B 0.225 x 0.115 Bond Pad #2 Vd_1_top 0.187 x 0.10 Bond Pad #9 Vd_2_bot_A 0.225 x 0.115 Bond Pad #3 Vg_1,2,3_top 0.10 x 0.10 Bond Pad #10 Vd_3_bot_A 0.225 x 0.115 Bond Pad #4 Vd_2_top_A 0.225 x 0.125 Bond Pad #11 Vd_3_bot_B 0.225 x 0.125 Bond Pad #5 Vd_3_top_A 0.225 x 0.125 Bond Pad #12 Vd_2_bot_B 0.225 x 0.125 Bond Pad #6 RF Output 0.125 x 0.20 Bond Pad #13 Vg_1,2,3_bot 0.10 x 0.10 Bond Pad #7 Vd_3_top_B 0.225 x 0.115 Bond Pad #14 Vd_1_bot 0.187 x 0.10 |
Similar Part No. - TGA4916_15 |
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Similar Description - TGA4916_15 |
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