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TGA4902-SM

April 2012 © Rev C

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Ordering Information

Part

Package Style

TGA4902-SM

QFN 4x4 Surface Mount

Recommended Surface Mount Package Assembly

Proper ESD precautions must be followed while handling packages.

TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven

vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed

in the table below.

Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.

The volume of solder paste depends on PCB and component layout and should be well controlled to

ensure consistent mechanical and electrical performance.

Solder attach process requires the use of no clean flux.

This part is not rated for high moisture environments.

Typical Solder Reflow Profiles

Reflow Profile

SnPb

Pb Free

Ramp-up Rate

3

°C/sec

3

°C/sec

Activation Time and

Temperature

60 – 120 sec @ 140 – 160

°C

60 – 180 sec @ 150 – 200

°C

Time above Melting Point

60 – 150 sec

60 – 150 sec

Max Peak Temperature

240

°C

260

°C

Time within 5

°C of Peak

Temperature

10 – 20 sec

10 – 20 sec

Ramp-down Rate

4 – 6

°C/sec

4 – 6

°C/sec